《Acm Transactions On Design Automation Of Electronic Systems》重点专注发布工程技术-计算机:软件工程领域的新研究,旨在促进和传播该领域相关的新技术和新知识。鼓励该领域研究者详细地发表他们的高质量实验研究和理论结果。该杂志创刊至今,在工程技术-计算机:软件工程领域,有较高影响力,对来稿文章质量要求较高,稿件投稿过审难度较大。欢迎广大同领域研究者投稿该杂志。
CiteScore | SJR | SNIP | CiteScore排名 | |||
---|---|---|---|---|---|---|
3.2 | 0.569 | 0.889 | 学科类别 | 分区 | 排名 | 百分位 |
大类:大类:ComputerScience
小类:小类:ComputerGraphicsandComputer-AidedDesign
|
Q2 | 50/106 | 53% | |||
大类:大类:ComputerScience
小类:小类:ElectricalandElectronicEngineering
|
Q3 | 405/797 | 49% | |||
大类:大类:ComputerScience
小类:小类:ComputerScienceApplications
|
Q3 | 453/817 | 44% |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
---|---|---|---|---|
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q3 | 32 / 59 | 46.6% |
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q2 | 59 / 131 | 55.3% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
---|---|---|---|---|
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q3 | 35 / 59 | 41.53% |
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q3 | 77 / 131 | 41.6% |
文章名称
引用次数
Emerging NVM: A Survey on Architectural Integration and Research Challenges
8
CAD-Base: An Attack Vector into the Electronics Supply Chain
6
Flexible Droplet Routing in Active Matrix-Based Digital Microfluidic Biochips
5
Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods
4
Performance-Aware Test Scheduling for Diagnosing Coexistent Channel Faults in Topology-Agnostic Networks-on-Chip
4
Enhancements to SAT Attack: Speedup and Breaking Cyclic Logic Encryption
3
Exploiting Chip Idleness for Minimizing Garbage Collection-Induced Chip Access Conflict on SSDs
3
Toward Effective Reliability Requirement Assurance for Automotive Functional Safety
3
Graph-Grammar-Based IP-Integration (GRIP)-An EDA Tool for Software-Defined SoCs
2
Instruction-Level Abstraction (ILA): A Uniform Specification for System-on-Chip (SoC) Verification
2
国家/地区
发文量
TUSA
94
TCHINA MAINLAND
39
TIndia
22
TTaiwan
20
TGERMANY (FED REP GER)
15
TSouth Korea
11
TCanada
9
TItaly
6
TBrazil
5
TJapan
5





